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PLC SYSTEM GE IS210WSVOH1A Heat Sink Assembly GE

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IS210WSVOH1A Heat Sink Assembly GE

GE IS210WSVOH1A


Origin:USA

Condition:New & Original

Packing weight:1.5kg

  • item no.:

    IS210WSVOH1A
  • lead time:

    IN STOCK
  • product orgin:

    USA
  • brand:

    General Electric
  • shipping port:

    XIAMEN
  • payment:

    T/T
  • product details

GE IS210WSVOH1A


3 pieces of Heat Sink Assembly IS210WSVOH1A + Servo Terminal Board IS200TSVCH1A   form a complete set.


About Heat Sink Assembly 

A heat sink assembly is a component used to dissip heat generated by electronic devices or components. It consists of a heat sink, usually made of materials with high thermal conductivity such as aluminum or copper, and sometimes includes additional components such as heat pipes, thermal pads, fans, or fins.

The primary purpose of a heat sink assembly is to transfer and dissipate heat away from the electronic device or component, preventing it from overheating and potentially damaging its performance or longevity. When an electronic device operates, it generates heat due to the resistance of electrical current flowing through its components. If the heat is not efficiently managed and dissipated, the device can overheat, leading to performance degradation or even failure.

A heat sink assembly works by providing a large surface area for heat transfer. The heat generated by the electronic device is conducted through a thermal interface material (such as a thermal paste or pad) that makes contact with the heat sink. The heat is then spread across the surface of the heat sink and is further dissipated through conduction, convection, and radiation.

Some heat sink assemblies also incorporate heat pipes, which are sealed copper tubes filled with a working fluid that transfers heat from one point to another through evaporation and condensation. Heat pipes can enhance heat transfer efficiency by rapidly transporting heat from the source to the heat sink.

In certain cases, heat sink assemblies may also include fans to improve airflow and increase the rate of heat dissipation. These fans help to move the heat away from the heat sink and maintain a lower operating temperature.

Overall, heat sink assemblies are essential in managing and controlling the temperature of electronic devices, ensuring their reliable operation and preventing thermal-related issues.


The relevant model number as below:

IS210WSVOH1A

DS200FSAAG1A
DS200SHVMG1AFE
DS2020LPPA301A
DS200SPCBG1A
DS200SDCCG1ACA
DS200FCRLG1AFC
DS200SDCCG1AEC
DS200SHCBG1ABC
DS200SIOBG1AAA
DS200SLCCG1ACC
DS200SDCIG1AGB
DS200IQXSG1AAA
DS200PCCAG9ACB
DS200DTBAG1AAA
DS200IPCSG1ABB
DS200CTBAG1A
DS200SHVMG1AFE
DS200PCCAG9ACB
DS200SHVIG1B
DS200IMCPG1CDB
DS200IMCPG1C
DS200TBQDG1AFF
DS200PCCAG7ACB
DS200PCCAG9ACB
DS200IPCSG1A
DS200FPSAG1ABB
DS200SHVMG1AFE
DS200LPPAG1AAA
DS200GGDAG1AHE


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